Whisker Control FFC

Lead co-deposition as an alternative of Tin Whisker mitigation has become obsolete as a result of RoHS directive on Jul 2006 that restricts the use of lead (Pb). Current methods for Tin Whisker mitigation which use Gold or Nickel to perform plating on copper (Cu) conductor wire for Flexible Flat Cable (FFC) is effective, but becoming uneconomical as gold price has increased 5 folds over the past 9 years. This provides the impetus to do research and development into other methods of Tin Whisker Mitigation which is effective, economical and yet environmentally friendly.


  • Reduction of COST to replace the use of GOLD (Au) Plating FFC by more than 30%
  • Improve product delivery LEAD TIME (no gold plating process & time required)
  • Environmental Friendly (eliminate the use of toxic chemical required by gold plating process)


  • Audio & Video Entertainment System
  • Blue-Ray Player
  • Optical Drive
  • Game Consoles
  • Smartphone/Tablet & Laptop PC
  • Laser/Inkjet Printers/Scanner
  • Mobile Devices utilizing serial I/O technologies
  • Others

Electron Microscope Picture

Normal Tin-Plated FFC with no Whisker Mitigation Control & Tin-Plated Connector (Reflow)

Ventura V-Flex® V3 FFC & Gold-Plated Connector

Ventura V-Flex® V3 FFC & Tin-Plated Connector (Reflow)

Whisker Growth clearly observed after 1000 hours

No Whisker Growth observed after 1000 hours

No Whisker Growth observed after 1000 hours